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Flexible Hybrid Electronics – Disrupting Conventional Packaging and System Design
Wilfried Bair
Senior Engineering Manager, Device Integration & Packaging
NextFlex

According to an IEEE Spectrum report released in 2016 the connected Internet of Things world is now forecasted to consist of about 30 billion objects by 2020. This number is reduced by almost half compared to the 50 billion connected devices by 2020 forecasted in 2010 by Ericsson and Cisco, and by over a third of the one trillion connected devices by 2020 forecasted in 2012 by IBM. An underlying premise of the successfully connected IoT object world is that those devices are low cost and ubiquitous so that they can be easily deployed. Devices lacking these crucial factors has created a barrier against widespread IOT adoption. Flexible Hybrid Electronics (FHE) addresses these issues with two unique factors that traditional technology cannot provide: it uses additive processing to reduce manufacturing cost and enables placement of devices on conformal, flexible or stretchable surfaces at low cost. Examples for industrial, medical, automotive and consumer markets will show how additive manufacturing, combined with flexible substrates, can deliver on the promise of “electronics on everything.”

An Alternative History of the Electronics Manufacturing Industry
Joseph (Joe) Fjelstad
Founder and President
Verdant Electronics

The electronics manufacturing industry has been continuously evolving since its humble origins more than 75 years ago. An annual industries survey conducted by JEITA in 2016 estimated that production by the global electronics and information technology industries estimated would be $2,680 billion and the infrastructure to make industry products is presently firmly entrenched. However, as an industry, we have collectively had many opportunities to make some important decisions that would impact how we made our products, and we too often made expedient choices over well thought through ones, one of the earliest being the choice of soldered pin in hole package technology over flat pack, surface mount technology for the first ICs. The industry has since followed the siren call of expedience much to our collective detriment. This thought experiment/talk will imagine a world where developers were given a clean slate and and a priori knowledge of the pitfalls of past decisions and choices relative to the design and manufacture of electronics from chip to final assembly and suggest points in time where better choices might have been made. The premise is that a different and better future was not only possible then but is still possible today. But it will only be possible if we will step back, think carefully about how we got here and then how we might alter slightly our path to enjoy the future we might have had. Examples of various earlier choices that have affected what we do in design and manufacture and how we do it will be presented and discussed relative to their impact past and present.

Emerging Challenges of Power/Reliability Analysis for FHE
Dr. Norman Chang
Chief Technologist, Semiconductor Business Unit
ANSYS, Inc.
Founder of Apache Design

Abstract to come

Advanced Low Dielectric Constant Materials: Leaning and Perspectives
Dr. Geraud DuBois
Head of Data Driven Science to Solutions Organization, Principal Research Staff Member, IBM Research / Adjunct Professor
Stanford University

Abstract to come

Process Design Kit (PDK) for Flexible Hybrid Electronics
Dr. Tsung-Ching “Jim” Huang
Senior Research Scientist
Hewlett-Packard Labs (HPE Labs)

Flexible hybrid electronics (FHE) integrating thinned silicon chips and flexile printed components, ranging from sensors to antennas, is emerging for applications such as internet of things (IoT) and wearables. For electronics designers to design FHE systems, however, the entry barrier is still high due to the lack of trustworthy device models and the design automation infrastructure. In this talk, I present our work in process design kit (PDK) for FHE that provides capabilities of FHE circuit simulations and design verifications with existing electronic design automation (EDA) tools. The key packages of FHE-PDK include technology files for design rule checking (DRC), layout versus schematics (LVS) and layout parasitics extraction (LPE), as well as experimentally validated SPICE models for flexible thin-film transistors (TFT) and passive elements such as resistors and capacitors. With FHE-PDK, the electronics designers can focus on FHE design innovations with guaranteed results of fabrication using additive manufacturing techniques.

Improving Health Through Continuous Blood Pressure Monitoring
Dr. Xina Quan
Co-founder and CTO
PyrAmes (a Stanford University spin-out)

With a greying populace in many parts of the world, there is a growing demand for health monitoring systems that are low-cost, discreet, comfortable, and easy to use. Advances in data analysis and electronics have fueled the development of wearable, digital health technologies. Further work is necessary to create devices that provide useful data in a low-cost form factor that people are willing to use. In this talk, I will cover some materials and design tradeoffs we are considering for a cardiovascular monitoring device we are developing at PyrAmes, a start-up spun out of Stanford with thin film sensor technology based on Prof. Zhenan Bao’s research on artificial skin.

 Other speakers to be
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