The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services. The Group generated sales revenues of $2.6 billion in 2009 and employs over 26,000 people worldwide.
Promex, Silicon Valley’s Packaging Foundry, integrates IC assembly and materials-centric packaging expertise with broad process and technical knowledge, enabling customers to take new products to market faster than by any other route. JEDEC standard and custom plastic over molded QFN/ TQFN and DFNs. Promex is a recognized leader in stacked die, thin molded, 2D, 3D, SMT and RoHS compliant packaging. SiPs, MEMS, MOEMS, MCM, LGA and RF packaging development and assembly. ITAR registered, ISO 13485 Medical certified. World wide customers are provided quick turns, development prototyping, NPI, scalable onshore and pre-Asia volume production.
Advanced Package Center (APC), offers a one-stop shop for delivery of research, development, qualification, prototyping and small volume manufacturing services. APC focuses upon MEMS, Sensors, and advanced IC and wafer level packaging realized through Boschman Technologies’ unique Film Assist Molding (FAM) technology. By working closely with customer R&D departments to explore new packaging concepts, APC provides value from Innovation to Industrialization.
Boschman Technologies is the world’s leading supplier of automatic molding systems using Film Assisted Molding (FAM) technology. QFN, SENSOR, MEMS, Solar and other unique applications like Bio-Sensors where bond pads, heat sinks, window or exposed die surfaces must be kept free of mold compound or resin bleed are ideally suited for our cost effective technology. As the holder of many FAM related patents, Boschman brings unique and proven solutions. In addition Boschman provides automatic molding solutions for conventional semiconductor devices and reel to reel smartcards.
Kionix, Inc., a global MEMS inertial sensor manufacturer based in Ithaca, NY, USA, offers high-performance, low-power accelerometers, gyroscopes, and 6-axis combination sensors plus comprehensive software libraries that support a full range of sensor combinations, operating systems and hardware platforms. Leading consumer, automotive, health and fitness and industrial companies worldwide use Kionix sensors and total system solutions to enable motion-based functionality in their products. Kionix is ISO9001:2008 and TS16949 registered. Kionix is a wholly owned subsidiary of ROHM Co., Ltd. For more information on Kionix visit www.kionix.com. For additional information on ROHM visit www.rohm.com.
Micrel, Inc., is a leading manufacturer of IC solutions. Micrel’s Custom Foundry Services allow customers to develop proprietary process flows, from R&D to high-volume production. Products include mixed-signal, analog, and power semiconductors, communication, clock management, Ethernet switch, and physical layer transceivers. Headquarters and state-of-the-art wafer fabrication facilities are in San Jose, CA, with offices and design centers globally.
Tousimis manufactures highly reliable Supercritical CO2 Dryers which enable delicate micro 3-D structural preservation. Our Critical Point Dryer (CPD) process technology eliminates surface tension forces. Current CPD applications include MEMS, Bio-MEMS, AeroGel, Nano Particle, Carbon Nanotube, Graphene and others. Tousimis is a USA based company located in the Washington D.C. area. Tousimis supports all products with our global sales and service support network.
XACTIX is the manufacturer of the Xetch® xenon difluoride (XeF2) etching systems with many different models to support small labs through high volume production. These dry isotropic etching tools are used to etch silicon, molybdenum and germanium and are popular in the MEMS community due to high selectivity versus many standard films including photoresist, silicon dioxide, silicon nitride, and aluminum. The Xetch® systems are particularly well suited for release, but are certainly not limited to MEMS applications and are useful for many applications where highly selective isotropic silicon, molybdenum and germanium etching is required. XACTIX also provides XeF2 etching services.
TECNISCO, LTD. is a subsidiary of Disco Corporation, a worldwide manufacturer of dicing saws and grinding machines. They supply customized parts that are manufactured with Glass, Metal, Ceramic, or Silicon by its advanced high-precision processes and composite technologies for the MEMS industry. Tecnisco’s expertise includes: dicing, ultrasonic machining, sandblasting, milling (drilling), assembling (AuSn, AuGe, AgCuIn, AgCu), polishing, bonding, plating, sputtering, vapor deposition and more. Their target is to be a best solution partner from trial production to mass production.
UBOTIC Company Limited provides advanced MEMS and Specialty Semiconductor prototype to production assembly with a focus on low cost open-tool and custom package design and fabrication. We provide package, lead-frame and substrate design and fabrication of molded Air Cavity QFN Packages (AQFN), LGA Cavity, Over-molded QFN, SOIC cavity, stack-die, ceramic, and custom MEMS SIP. Additional services include both Thermal & Electrical Modeling along with package qualification and reliability testing.
Pac-Tech USA Packaging Technologies Inc. facility in Santa Clara, California offers contract wafer bumping services using low cost electroless Ni/Au under-bump metallization, solder stencil printing and solder ball placement for quick-turn and mass-production. PacTech USA also provides product demonstrations, training and sales support.
Pac Tech designs and builds state-of-the-art wafer bumping and assembly equipment for flip-chip and chip-scale packaging. Pac Tech is the worldwide leader in laser reflow and heating technology as implemented in systems for solder jetting (SB2) and flip-chip attach (LAPLACE) for advanced packaging applications like HGA assembly, MEMS and optoelectronic packaging, LCD driver assembly, etc.
SoftMEMS is the creator of the popular, powerful, easy-to-use CAD tool suites MEMS Pro, MEMS Master and MEMS Xplorer. Software functionalities encompass mixed MEMS/IC schematic capture, simulation, optimization, statistical analysis, full custom mask layout, manufacturing rule verification, 3D model generation and visualization from manufacturing process descriptions, behavioral model creation and links to 3D analysis packages.