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Amkor Technology, Inc. is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor’s operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect. |
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NextFlex mobilizes companies, academic institutions, nonprofits, and state and local governments toward a single goal: to advance the manufacturing ecosystem for flexible hybrid electronics (FHE) in America. NextFlex solicits and funds collaborative project ideas to address technological gaps in FHE capabilities. Members receive access to intellectual property, new product ideas, and invaluable partnering opportunities. Join us and become a part of the flexible revolution. |
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TechSearch International was founded in 1987 as a market research and consulting company specializing in emerging semiconductor packaging trends. Multi- and single-client services encompass market research, technology trends, and strategic planning. Research topics include flip chip, WLP, CSPs, BGAs, 3D TSVs, multichip packages (MCPs) such as stacked die CSPs, PoP, and System-in-Package (SiP), embedded components, microvia substrates, high-brightness LEDs, medical electronics, semiconductor packaging and assembly material developments and markets, and Pb-free manufacturing trends. Market forecasts and trends in advanced semiconductor packaging developments are available. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe and travel extensively, visiting major electronics manufacturing operations and research facilities worldwide. |
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Micralyne is a provider of novel MEMS solutions and architectures for BioMed, Optical and Industrial Sensor applicaitons. For more than 30 years, Micralyne has delivered world-class MEMS sensor solutions used in various applications like pressure sensors, gas sensors, accelerometers, thermal imaging sensors and optical communications. These products find application in number of industries such as: life sciences, aerospace, automotive, oil and gas, military, commercial and environment.
Micralyne has a complete offering of capabilities to support the customer’s needs from concept to volume production. These capabilities include Wafer Level Packaging – MicraSilQ, discrete packaging, and custom sub-assembly services.
DeWeyl Tool provides the finest quality bonding wedges in the world. Located in Petaluma, CA (Northern California) in the Sonoma / Napa wine region, our primary business is manufacturing wirebond wedges, die pickup tools, and custom high precision tooling for the semiconductor, aerospace, and medical industries. The wedges we produce are made from ceramic, titanium, and tungsten carbide, and are used in bonding aluminum, gold, copper, and platinum wires.
XYZTEC, Inc. offers the most advanced bond testers on the market. Innovations introduced by XYZTEC include;
1.) Rotating Measurement Unit (RMU) that allows permanently mounting 6 different sensors that are capable completing over 30 different test types
2.) Bond test automation with fiducial pattern recognition.
3.) A vision correction system that will identify wire position through optics and adjust the stage to the proper test position.
4.) fully automated wafer test system that can test up to 300mm wafers with auto load/unload, defect identification and auto grading.
TECNISCO is a process service provider of precision components. They support design and manufacturing with our "cross-edge" microprocessing technology. In particular, their processing is used in the following fields: structured glass wafers for MEMS packaging, glass microfluidics for drug discovery and chemical reaction, customized heatsinks for Laser Diodes and LEDs. They provide the four following advantages by undertaking several processes as a one-stop solution partner: maintaining the stability of product quality, shortening the lead time, providing better cost-performance products and services and solving customers' problems by crossing our technologies and developing original products.
About "cross-edge" microprocessing: TECNISCO's original technologies provide the products which meet customers' needs best from the viewpoint of quality, cost and productivity with combined technologies, crossing five processing technologies such as: cutting, grinding, polishing, metallization, and bonding.
NTK Technologies is a leader in IC Ceramic Packaging. With global service centers, NTK offers a wide range of packaging materials and design services for Opto, FPGA, CPU, MPU, MCM, RF, CMOS Image Sensors, Hi-Rel, Satellite, Automotive, LED, and Medical applications. Optimum package designs for 10G, 40G, and 100G. NTK also offers an advanced technologies for probe card substrates including ceramic single thin film and Hybrid ceramic, copper/polyimide multilayer substrates, among other materials.
Gel-Pak develops unique materials for device handling. The Gel-Pak product line securely holds fragile components in place during shipping, handling, and processing. For over 30 years, the ISO certified company has been an industry leader in guaranteeing safe transport and storage of cutting-edge technologies ranging from 250µm chips to 300 mm wafers and substrates.
Eco-Snow Systems, a division of RAVE N.P., Inc., has been in business since 1997 providing advanced, automated cryogenic dry cleaning solutions to MEMS and MEMS packaging manufacturers, semiconductor IDM’s, virtually all photomask manufacturers and many other hi-tech industries. The technology was developed at Hughes Aerospace for cleaning of optics and satellite systems. Our patented technology based on cryogenic CO2 aerosol is capable of damage-free removal of particles as large as 10 microns and as small as sub-40 nm for semiconductor devices while protecting the underlying films and substrates. This technology is a dry process that leaves no residue, is non-oxidizing, and does not etch the surface of the substrate.
Eco-Snow Systems welcomes customers performing demos in our state-of-the-art class 10 cleanroom located in Livermore, California.
American Elements, global manufacturer of high purity metals, semiconductors, nanomaterials, sputtering targets & evaporation materials for optoelectronics, sensors, thin films, & MEMS devices.
UBOTIC Company Limited provides advanced MEMS/sensor and specialty semiconductor prototype to production with a focus on low cost open-tool and custom packaging as well as housing/lid design and fabrication. We provide packages, lead-frame and substrate design along with fabrication of molded air cavity QFN package (AQFN), LGA cavity, over-molded QFN, SOIC cavity, stacked-die, ceramic, custom lids, molded housing, and SIP. Additional services include both thermal and electrical modeling along with package qualification and reliability testing. The factory is certified in TS16949:2009 and ISO9001-2008.
SoftMEMS LLC is the creator of the popular, powerful, easy-to-use CAD tool suites MEMS Pro, MEMS Master and MEMS Xplorer. Software functionalities encompass mixed MEMS/IC schematic capture, simulation, optimization, statistical analysis, full custom mask layout, manufacturing rule verification, 3D model generation and visualization from manufacturing process descriptions, behavioral model creation and links to 3D analysis packages.
Sonoscan® provides non-destructive analysis for process control and quality assurance to safeguard your MEMs products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for Front, Mid and Back-End microelectronics. Including the C-SAM® AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMs devices in trays.
Sonoscan, the leader in Acoustic Microscopy (AM), manufactures systems in the USA with regional laboratories in Asia, Europe and the USA for AM inspection services. Our C-SAM® technologies have set the standard for 40 years.
AmTECH Microelectronics, Inc. MICROELECTRONICS ASSEMBLY TECHNOLOGIES including ADVANCED PACKAGING and SMT ASSEMBLY on PCB, FLEX and CERAMIC substrates.
We support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our Silicon Valley facility includes 2500 square feet CLEANROOM ISO 7 with on-site Process Development, Engineering and Manufacturing support.
Advanced Packaging: we support precision Die Attach, Flip Chip, Wire Bond (Au ball, Au Wedge, Al Wedge), and Encapsulation with Glob Top, Dam & Fill and UV materials.
SMT Assembly: Lead-free with 0201, BTC, QFN, CSP, uBGA and 0.4mm pitch IC and Connectors. PCB from 0.012” to 0.200”, Flex from 0.004” to 0.010”, Ceramic 0.010” to 0.040” Thickness.
Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.
Quik-Pak is an industry leader in creating IC packaging and assembly solutions that accelerate your time to market. Our advanced assembly techniques and equipment provide the capability to assemble unique MEMS devices, including chemical, environmental, and pressure sensors, and other configurations requiring an air cavity. Quik-Pak also provides a wide variety of wafer dicing and wafer thinning services for silicon and composite materials.
Veryst Engineering, LLC provides premium engineering services and consulting at the interface of technology and manufacturing. Located near Boston, Massachusetts, Veryst provides services in product design, manufacturing processes, and failure analysis to firms worldwide. We have internationally-recognized expertise in MEMS and reliability, and of our more than 50 years of cumulative industry experience in yield, reliability, and failure analysis, more than 25 of those years are in the MEMS world. Service is based on engineering fundamentals – employing grounded knowledge of mechanics, physics, and manufacturing to produce practical, useful results. Our consultants’ backgrounds encompass teaching, extensive publications, industrial experience, and research.
SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.
FRT of America is recognized as a valued partner for non-contact, optical metrology systems. FRT of America serves you by providing high-quality automated measuring tools that fulfill your research, inspection and process verification needs. The MicroProf® TTV measures wafer thickness, TTV, bow and warp for full thickness, thinned and bonded wafers. The WLI PI sensor is for measuring high aspect ratio trenches and bumped wafers and the CWL IR is for measuring silicon thickness on bonded wafers. The MicroSpy® Topo DT is a high resolution 3D profilometer with confocal and interferometric measuring modes.
Milestone Technology is a Failure Analysis Lab providing services for the MEMS, Semiconductor, LED, Medical Device, Solar, Electronics, Nanotech, Disk Drive, Optical, Coating, Ceramics and Materials industries. We specialize in Ultra High Resolution SEM, EDX, Quantitative Analysis, Mapping, Precision Cross-Sectioning, Surface Contamination, FTIR, PCB/BGA Inspection, Dye Pry, and Metallography.
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.
Palomar Technologies Assembly Services™, located in Carlsbad, CA, is the contract assembly, process development, test and prototyping division of Palomar Technologies. Assembly Services provides process expertise with high-precision die attach, wire bond and component placement services, offering its customers an alternative route to meet complex packaging needs without investing in capital equipment.
www.palomartechnologies.com
PROMEX Industries, located in Silicon Valley, provides one-stop microelectronics assembly, advanced packaging & semiconductor assembly services to the medical and bioscience, commercial semiconductor and military markets. Our renowned technical staff applies deep materials science expertise with our uniquely broad process capabilities to responsively accelerate new products to market from concept through onshore production. PROMEX has a proven track record for the packaging development, launch support and volume production of innovative and complex microelectronics assemblies. Facilities include Class 100, Class 1000 clean rooms, integrated SMT / PCBA, development, assembly and test areas. Supply chain management and turnkey procurement available. ISO 13485:2003, ISO 9001:2008 certified and ITAR registered.
Tousimis is a globally recognized manufacturer of highly reliable CPD systems based in the Washington, DC area with global sales and service support. Four decades plus of CPD experience enables ground breaking design and patented firsts have crafting our technological edge for you. Our CPD process delicately preserves micro & Nano 3-D structure with reproducibility. Our technique enables successes for you in the following applications: MEMS / Bio-MEMS / AeroGEL / Nano Particle / Carbon Nanotubes / Graphene / MOF and WHATEVER others you can imagine. We are honored to be a member of the MEMS community.
