Enabling The Future Of Information Technology Through Heterogeneous Integration
Dr. W. R. Bottoms, Chairman of Third Millennium Test Solutions
Co-Chair Heterogeneous Integration Roadmap

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density and cost threaten our ability to maintain the progress that has enabled the growth of information technology.

Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. We will not have a replacement for the CMOS switch in the near term to maintain the pace of progress through device scaling. Only a revolution in packaging through 3D-SiP and heterogeneous Integration can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. These difficult challenges and potential solutions will be discussed.