item11a
item11a
item11a item11a
item11a
item11a
item11a item11a
item11a
item11a item11a
item11a item11a
item11a item11a
item11a item11a
item11a
item11a item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a item11a
item11a
item11a item11a
item11a item11a
item11a
item11a item11a item11a item11a
item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item4
BondingWireTopLineTanaka315

Changing Times in the OSAT Market: What’s Next?
E. Jan Vardaman, President, TechSearch International, Inc.

The semiconductor industry packaging and assembly industry is maturing and companies face many challenges. This presentation looks at packaging and assembly trends, new business models, and challenges for growth in the OSAT market. Key issuesinclude:

• Wire bond still accounts for the bulk of the industry, how strong
growth in advanced packaging, defined as flip chip and wafer
level packaging (WLP)?

• How will OSATs respond increased competition from foundries?

• How will the growth in China impact the OSAT industry?

This presentation examines these trends and discusses the changing OSAT market.

PerfectionProductsBanner
MeptecBanner2CCGA
HenkelBanner
x180AmkorMEPTECbanner