Welcome to our Low Temperature Assembly Technologies for Flexible Hybrid Electronics World. CONNECTEC JAPAN specializes in semiconductor assembly business “OSRDA” (Outsourced Semiconductor Research, Development & Assembly), which provide clients a one-stop solution including substrate design, structure proposal, process development, proto-typing, evaluation, analysis and mass-production.
Our unique MonsterPAC® , Low-Temperature (down to 80 degree C), Low-load and Less-damage Flip Chip bonding and component assembly technologies will not only minimize harmful effects on subtle sensor chips or MEMS devices, but also make it possible to assemble such chips onto heat intolerant flexible substrates, including PET film and PU film. We also develop semiconductor related applications in cooperation with our partner companies.
If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. We help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and engineer products limited only by imagination.
Founded in 1970, ANSYS employs 3,000 professionals, including expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost.
Promex delivers innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices. Located in Silicon Valley since 1975, we provide design for manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding and Class 100/Class 1000 cleanrooms. IC packaging, including overmolded QFNs, are available in five days from our Quik-Pak San Diego Division. Promex is ISO 13485/ISO 9001 and IPC certified and ITAR registered.
Visit www.promex-ind.com or call 408-496-0222.
SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.
For more than 35 years, Gel-Pak has provided the world’s largest semiconductor, photonics, and optoelectronics manufacturers with innovative device carrier and protection products. Gel-Pak’s products effectively immobilize sensitive devices during shipping, handling and processing – protecting them from damage. Gel-Pak’s unique Vacuum Release Carriers have been tested and qualified to transport and store ultra-thin die used in today’s Flexible Hybrid Electronics.
For over 70 years NAMICS CORPORATION has been a the leading source for advanced packaging materials for high technology applications. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore and China, NAMICS serves its worldwide customers with enabling products for leading edge applications. Offering such materials as flexible die attach, stretchable ink, and high reliability epoxies it is no wonder why many customers trust NAMICS to ensure their high reliability needs.
SoftMEMS LLC is the creator of the popular, powerful, easy-to-use CAD tool suites MEMS Pro, MEMS Master and MEMS Xplorer. Software functionalities encompass mixed MEMS/IC schematic capture, simulation, optimization, statistical analysis, full custom mask layout, manufacturing rule verification, 3D model generation and visualization from manufacturing process descriptions, behavioral model creation and links to 3D analysis packages.
Universal Instruments Corporation
Universal offers a wide-range of unique solutions and many years of expertise in today/future Flexible Hybrid Electronics assembly. Some of our core competencies include: flex circuit and thin film handling, high-accuracy thin die and passive placement, ultra-fine pitch placement, and a true volume hot bar bonding solution. In addition, our industry-leading Advanced Process Lab (APL) is heavily involved in research into solving FHE assembly challenges.