item15
item14

Wilfried Bair
Senior Engineering Manager, Device Integration & Packaging, NextFlex

Wilfried Bair is responsible for device integration and system level hardware projects for NextFlex. Prior to joining NextFlex, Wilfried was VP of Business Development for Tango Systems where he developed strategic partnerships and led them to enter the two fastest growing semiconductor packaging market segments, establishing them as a market leader. Previously, as VP of Strategic Business Development for SUSS Microtec AG, Wilfried provided leadership to business units, identifying disruptive technology gaps, new marketing opportunities and acquisition targets. Other positions held at SUSS were GM, North American Operations, and Division Manager of Wafer Bonders. Wilfried’s technical expertise spans leading edge packaging processes, next generation solar and energy storage, semiconductor equipment and process, and device expertise for automotive, consumer and medical applications. Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational Development, and International Marketing from the University of Linz in Austria.

Reinhold Dauskard
Department of Materials Science and Industry, Stanford University

Reinhold Dauskardt is the Ruth G. and William K. Bowes Professor in Materials Science and Engineering and has courtesy appointments in Mechanical Engineering, the Biodesign Institute and the Surgery, Stanford School of Medicine. He is a Visiting Professor at the Nanyang Technological University, Singapore. The underlying theme of his research is to enable the innovation, molecular design and integration of high-performance materials into nanoscience and energy technologies by exploiting the fundamental connection between material structure and resulting device performance, thermomechanical function and reliability.

 

Jason Marsh
Director of Technology, NextFlex

Jason Marsh is responsible for setting the technical direction of NextFlex, including managing Technical Council activities. Prior to joining NextFlex, Jason worked in Asia, Europe and throughout North America establishing greenfield factories for Kyocera and developing new materials and supply-chain strategies for Insulectro. Jason studied materials science and robotics at Stanford University, and has served on a variety of advisory boards in artificial intelligence, solar power, and agriculture.

Dr. Norman Chang
Chief Technologist, Semiconductor Business Unit, ANSYS, Inc.

Norman Chang co-founded Apache Design Solutions in February 2001 and currently serves as Chief Technologist at Semiconductor BU, ANSYS, Inc. He is also currently leading the effort of applying ML/DL at ANSYS. Prior to Apache, Dr. Chang lead a group at Palo Alto HP Labs, focused on interconnect related signal/power integrity issues and contributing to the HP-Intel IA64 micro-processor design. Dr. Chang received his BS, MS, and Ph.D. in Electrical Engineering and Computer Sciences from University of California, Berkeley. He holds thirteen patents and has authored over 50 technical papers. He also co-authored the popular book, “Interconnect Analysis and Synthesis”, published by John Wiley & Sons, 2000. He is currently in the committee for ESDA-EDA and SI2 Open3D TAB.

Dr. Geraud DuBois
Head of Data Driven Science to Solutions Organization, Principal Research Staff Member, IBM Research / Adjunct Professor
Stanford University

Dr. Geraud Dubois obtained his Ph.D. degree in Chemistry summa cum laude from the Montpellier II University in France in 1999. He is a World class expert in Materials Science, who continues to push the boundary of innovation from fundamental research (author of 55 peer reviewed publications) to applied research (39 US Patents issued). With his team, they have Initiated 2 paradigm shifts in the development and integration of porous low dielectric constant materials for interconnects in advanced semiconductor technology nodes. He has also been an Adjunct Professor at Stanford University since 2009. He is currently a Principal Research Staff Member and the head of the Science to Solutions division, a newly formed organization of 50+ cross-disciplinary scientists, with the mission to redefine Science through big data and AI to create cognitive solutions for microbes and molecules.

Dr. Tsung-Ching “Jim” Huang
Senior Research Scientist, Hewlett-Packard Labs (HPE Labs)

Dr. Tsung-Ching “Jim” Huang is a senior research scientist with Hewlett-Packard Labs (HPE Labs) at Palo Alto, USA. He received his Ph.D. in Electrical and Computer Engineering from University of California at Santa Barbara. He is now leading wearable and IoT research projects in Hewlett-Packard Labs. Prior to HPE Labs, he was with Taiwan semiconductor manufacturing company (tsmc) and he had been involved with the development of PDK and intellectual property (IP) blocks with state-of-the-art CMOS technology. Dr. Huang is a pioneer in flexible circuit design and electronic design automation for flexible electronics. He invented a design style named “Pseudo-CMOS” that received Best Paper Award in International Symposium for Flexible Display and Electronics (ISFED) 2007 and Best Paper Award in IEEE Electron Device Meeting (IEDM) 2011. Pseudo-CMOS leads to many performance breakthroughs of flexible electronic systems and is widely used among electronics designers around the world. He authored a book “Design, Automation, and Test for Low-Power and Reliable Flexible Electronics” – the first book dedicated for circuit design and design automation with flexible electronics (ISBN: 1601988400). Dr. Huang is a senior member of IEEE.

Dr. Xina Quan
Co-founder and CTO, PyrAmes

Dr. Xina Quan is Co-founder and CTO at PyrAmes. She has led interdisciplinary teams that have transformed advanced materials research into innovative commercial products for the photonics, telecommunications, optoelectronics, and consumer electronics markets for over three decades. Prior to founding PyrAmes, Dr. Quan led the R&D efforts at Artificial Muscle Inc., Cambrios, and DigiLens. She also managed product development and research programs at Bayer MaterialScience, Lumileds Lighting and AT&T/Lucent Technologies Bell Laboratories. Dr. Quan earned her S.B. and M.S. degrees from MIT and her Ph.D. from Princeton University, all in chemical engineering, and is a registered patent agent with the USPTO. She has more than 30 issued and pending US patent filings.

Herb Reiter
President, eda 2 asic Consulting, Inc.

After more than 20 years in engineering and business development roles at ASIC vendors and EDA software companies, Herb founded eda2asic Consulting, Inc. in 2002. Initially he introduced tools and IP for simplifying single-die “2D-ICs” design efforts. Herb earned an MSEE and MBA degree in Austria/EUROPE, an MBA from San Jose State University and has attended more than 40 Continuing Education Classes at Stanford University.

 


Dr. Jayna Sheats

CEO, Terecircuits Corporation

Dr. Jayna Sheats is CEO of Terecircuits Corporation. She was a co-founder of Terepac Corp, and Vice President of Manufacturing Technology and subsequently Associate CTO at Nanosolar, Inc. after spending two years in consulting and entrepreneurial development in thin film electronics, particularly involving roll-to-roll processing techniques, and co-founding two companies (Rolltronics and Intelleflex). Prior to this, she spent 20 years in R&D at Hewlett-Packard Labs, working on a wide variety of projects in thin film electronics, including microlithography, superconductivity, and organic electroluminescence. She also initiated and supported a program to introduce Internet technology in the developing world. She is a fellow of the AAAS, with a PhD in physical chemistry from Stanford University, and has authored or co-authored 60 journal and book articles and 50 patents.

CONTACT US
item2
item3
HOME
BIOGRAPHIES
SPONSORS
VENUE & ACCOMMODATIONS
ABSTRACTS
item10
SPONSORSHIPS
REGISTRATION & PRICING

Wilfried Bair
Senior Engineering Manager, Device Integration & Packaging, NextFlex

Wilfried Bair is responsible for device integration and system level hardware projects for NextFlex. Prior to joining NextFlex, Wilfried was VP of Business Development for Tango Systems where he developed strategic partnerships and led them to enter the two fastest growing semiconductor packaging market segments, establishing them as a market leader. Previously, as VP of Strategic Business Development for SUSS Microtec AG, Wilfried provided leadership to business units, identifying disruptive technology gaps, new marketing opportunities and acquisition targets. Other positions held at SUSS were GM, North American Operations, and Division Manager of Wafer Bonders. Wilfried’s technical expertise spans leading edge packaging processes, next generation solar and energy storage, semiconductor equipment and process, and device expertise for automotive, consumer and medical applications. Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational Development, and International Marketing from the University of Linz in Austria.

Joseph (Joe) Fjelstad
Founder and President, Verdant Electronics

Verdant Electronics founder and President Joseph (Joe) Fjelstad has more than 35 years of international experience in electronic interconnection and packaging technology in a variety of capacities from chemist to process engineer and from international consultant to CEO. Mr. Fjelstad is also a well-known author and magazine columnist writing on the subject of electronic interconnection technologies. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe a leader in the development of high speed interconnection technologies. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his innovations.

VENUE & ACCOMMODATIONS ABSTRACTS