ASM Pacific Technology founded in 1975, is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process - from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise. Our Back-End Equipment Business offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, photonics, and optoelectronics industries. Our Materials Business provides customers with a variety of leadframes such as etched and stamping as well as advanced packaging materials. Our SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions.
 

Integra Technologies, a global provider of semiconductor services for high reliability applications, offers full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services. Integra is uniquely qualified to serve mission-critical applications where dependability and failure-free performance are paramount. Integra’s services include die prep, advanced packaging, electrical testing, qualification and reliability, destructive analysis and failure analysis.



Mentor, A Siemens Business is the worldwide market leader in PCB systems design, advanced IC packaging solutions, and analysis technologies. Recently awarded the 3DInCites "EDA Supplier of the Year" award, Mentor will showcase its Xpedition(R) High Density Advanced Packaging (HDAP) solutions for prototyping, design, and verification of heterogeneous multi-substrate designs such as FO-WLP, 2.5D, and system-in-package. Visit our booth to learn more about Mentor’s technologies and best practices for IC/Package/Board co-design.



NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.



SEMI is a global industry association serving companies the manufacturing supply chain for semiconductors: device manufacturers, equipment material and other service providers, flexible electronics, micro-electromechanical systems (MEMS), sensors, photovoltaic and other related technologies. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world.

The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry.



Silitronics provides vertically integrated assembly solutions for SiP modules including: Lidar, Silicon Photonics, Sensors, Medical and Defense. Silitronics is one of the Silicon Valley company with 100% turn key solutions in: Design, Substrate, Assembly and Test which helps customer to save time and price. Silitronics has been serving North American customers for last 25 years from 13,000 sq ft facility with Clean Room 10K and 1000. Silitronics has ISO 13485:2016, ISO 9001:2015, ITAR (pending) and compliant to Mil-Std 883. Silitronics team have over 100 years of domain experience and has abilities to do < 24 hours cycle time for urgent builds. Silitronics takes full accountability from NPI to High Volume, which enables customers to focus on design and validation of their products.
 

TechSearch International was founded in 1987 as a market research and consulting company specializing in emerging semiconductor packaging trends. Multi- and single-client services encompass market research, technology trends, and strategic planning. Research topics include flip chip, WLP, CSPs, BGAs, 3D TSVs, multichip packages (MCPs) such as stacked die CSPs, PoP, and System-in-Package (SiP), embedded components, microvia substrates, high-brightness LEDs, medical electronics, semiconductor packaging and assembly material developments and markets, and Pb-free manufacturing trends. Market forecasts and trends in advanced semiconductor packaging developments are available. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe and travel extensively, visiting major electronics manufacturing operations and research facilities worldwide.