Innovation is accelerating smart, connected devices enabling the Intelligence of Things™. Dr. Vrtis will discuss the systems, packaging and circuit technologies that are converging and enabling opportunities in legacy markets and the creation of new markets such as wearable technologies, connected home, auto and more.

Joan K. Vrtis, Ph.D. is the Chief Technology Officer at Multek, subsidiary of Flex, leading sketch to scale solutions company that designs and builds intelligent products for a connected world. Multek is one of the world’s leading printed circuit board suppliers with eight production sites globally and a comprehensive product portfolio that extends beyond standard printed circuit boards to high density interconnects, flexible printed circuits, rigid-flex, flexible circuit assemblies, flexible materials and printed electronics. Click here for more about Dr. Vrtis.

This is one of the most exciting times to be innovating with semiconductors. Mega-trend opportunities in IoT, biotech, wearables, energy, transportation, and mobile will all have new semiconductor innovation at their core. These markets enable novel and valuable products that do not require leading-edge technologies and enormous R&D budgets. However, many of these startups require innovative packaging solutions both from a product design and technology perspective to meet cost performance and form factor requirements. This presentation will provide real examples and insights into such innovations.

These new semiconductor start-ups face challenges including fierce competition for funding, expensive design costs, and complex processes for bringing new designs to market. Reducing upfront costs creates start-ups that become much better investments and follow-on funding can go to true innovation and value creation. Developing an ecosystem of leading companies and experienced individuals that offer needed capabilities under a framework that recognizes the challenges of this space is an approach that is gaining traction. Startups in this space need an ecosystem of silicon experts encompassing tools, testing, packaging, production, and financing to make this happen.

Tarun Verma is a Partner at Silicon Catalyst, where he is an interconnectologist – driving the integration of packaging value proposition onto product portfolio development. He is a semiconductor technical and operations executive with more than 20 years of experience in all aspects of backend semiconductor engineering including supply chain management and fabless semiconductor operations. Previously he was Senior Director of Packaging Engineering at Altera. Click here for more information about Silicon Catalyst.