AmTECH Microelectronics, Inc. MICROELECTRONICS Manufacturing Services including Advanced Packaging, Die bond, Wire Bond, and Encapsulation with mixed technology and SMT Assembly RoHS solder on PCB, PCF, Ceramic, Silicon or other type of substrate materials.

We can support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our facility includes 2,500 square feet Cleanroom ISO 7 with Engineering support, new cutting edge technology and fully automated equipment.

We can support fully automated and precision Die Bond, Wire Bond (Au ball, Au Wedge, Al Wedge, and Ribbon), Dam & Fill, Glob Top, UV Curable materials and Flip Chip. In addition we have full capabilities for SMT Assembly down to 0.3mm pitch, 0201, uBGA, QFN and WLCSP components on 100-200 um thick PCF (Printed Circuit Flex) and 200-500 um thick PCB (Printed Circuit Boards) including XRAY and AOI Inspection. You can contact AmTECH at (408) 612-8888.

www.amtechmicro.com

Quik-Pak, a division of Promex Industries, provides IC packaging, assembly, and wafer preparation services in its ISO 9001:2008 registered facility in San Diego, California. Quik-Pak manufactures overmolded and pre-molded open cavity QFN packages that provide a fast, inexpensive solution for prototype to full production needs. Same-day assembly services are provided to shorten time to market. In addition to wire bond assembly for MW/RF applications, the company assembles flip chips, BGAs, sensors, MEMS, and chip-on-board and chip-on-flex assemblies.

www.icproto.com

PROMEX Industries offers complete turnkey microelectronics assembly, advanced packaging & semiconductor assembly services, including quick turns, to the medical, commercial semiconductor and military markets. Our world class technical staff applies process expertise and deep technical understanding across our broad process capabilities. PROMEX is a recognized leader in custom process development and assembly of complex system-in-package and medical microelectronics, including Class III and bioscience microfluidics devices. Turnkey package design services, simulation, characterization and test accelerate products to market. Customers are provided with immediate volume manufacturing, or the sequential steps of process development, prototypes, new product introduction, scale up and onshore production. Full turnkey materials and supply chain management available. ISO 13485:2003, ISO 9001:2008 certified and ITAR registered.

www.promex-ind.com

NTK Technologies is a leader in IC Ceramic Packaging. With global service centers, NTK offers a wide range of packaging materials and design services for Opto, FPGA, CPU, MPU, MCM, RF, CMOS Image Sensors, Hi-Rel, Satellite, Automotive, LED, and Medical applications. Optimum package designs for 10G, 40G, and 100G. NTK also offers an advanced technologies for probe card substrates including ceramic single thin film and Hybrid ceramic, copper/polyimide multilayer substrates, among other materials.

www.ntktech.com

SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move your MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of your new MEMS sensor product to the market. Microelectronic package assembly is a key part of the manufacturing process for MEMS sensor products. Our core capabilities and expertise support development and prototyping, environmental life testing, and manufacturing of designs provided by our customers.

www.smartmicrosystems.com

AIR-VAC Engineering is a manufacturer of Die Bonding and Micro-Assembly Equipment for the Semiconductor, Photonic and SMT markets. Systems can be table-top designs or full production cells. Features include eutectic ovens, wafer ejectors, dispensing and curing, feeders, component flippers and tool changers. Applications for die attach, component sorting, rework and repair, gold/tin, lead-free, epoxy are some examples.

www.air-vac-eng.com

SHINKO ELECTRIC INDUSTRIES CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. SHINKO manufactures a full line of Organic Substrate structures including coreless options offering enhanced electrical performance and package size reduction. SHINKO can also provide subcontract IC assembly services with an emphasis on packaging solutions such as PoP, SiP and Camera Modules utilizing our advanced package assembly technologies, including our molded core embedded package (MCeP™). SHINKO is located in Nagano, Japan and provides the ultimate in service and solutions for our customers with Sales and Engineering support worldwide.

www.shinko.com

Universal’s core products include a comprehensive surface mount platform portfolio; leading-edge advanced semiconductor packaging solutions; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities; and industry-leading support and services worldwide

www.uic.com

SHENMAO America, Inc., a subsidiary of SHENMAO Technology, Inc., the third largest Solder Materials Provider founded in 1973, produces SMT Solder Paste in its San Jose, CA, USA facility, markets Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, Wave Solder Bar, Solder Wire, Flux and Solder Preforms from 10 worldwide locations as the strategic manufacturing partner of leading OSAT’s, the top EMS and OEM’s. SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. SHENMAO MICRO MATERIAL INSTITUTE 36 applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers.

www.shenmao.com

Amkor Technology, Inc. is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor’s operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect.

www.amkor.com

Advanced Component Labs, Inc. is the USA’s leading fabricator of “Time Critical” High Density Interconnects. With a sharp focus directed towards the semiconductor packaging and test communities, ACL’s HDI fabrications offer a direct response to the market’s constantly increasing need for shorter lead times and improved device performance. ACL’s current process technologies include 15µm circuit geometries, 20µm dielectric layers, 50µm laser vias, multi layer build ups and a strong comprehension of both high frequency and high speed package requirements. By selecting ACL for your program, you are choosing an ITAR registered, US fabricator with an unparalleled record for quality, on-time delivery performance and world class capabilities.

www.aclusa.com

SPONSORS & EXHIBITORS

Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in Cu Wire, SiP, WLP, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit our website.

www.aseglobal.com